Mating and piercing micromechanical structures for surface bonding applications
Conference Paper, Proceedings of Micro Electro Mechanical Systems (MEMS '91), pp. 253 - 258, February, 1991
Abstract
The authors have developed two types of micromechanical structures, using silicon micromachining techniques, which act as mechanical adhesives. Arrays of structures are fabricated on standard silicon wafers, with an areal density of approximately 200000 per cm/sup 2/, resulting in very strong bonds. Individual components are 4-18 mu m wide, and 4-15 mu m high above the substrate. Mating structures, which interlock with themselves, and piercing structures, which interlock with biological tissues, have been fabricated and tested. The mechanical behavior of this micromechanical velcro is in approximate agreement with the calculated strength.
BibTeX
@conference{Han-1991-13209,author = {H. Han and Lee Weiss and M. L. Reed},
title = {Mating and piercing micromechanical structures for surface bonding applications},
booktitle = {Proceedings of Micro Electro Mechanical Systems (MEMS '91)},
year = {1991},
month = {February},
pages = {253 - 258},
}
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