Liquid Metal-Microelectronics Integration for a Sensorized Soft Robot Skin - Robotics Institute Carnegie Mellon University
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PhD Speaking Qualifier

April

30
Mon
Tess Hellebrekers Robotics Institute,
Carnegie Mellon University
Monday, April 30
11:00 am to 12:00 pm
Scaife Hall 224
Liquid Metal-Microelectronics Integration for a Sensorized Soft Robot Skin

Abstract:
Progress in the emerging field of soft robotics depends on the integration of sensors that are capable of sensing, power regulation, and signal processing. Commercially available microelectronics are well suited for these needs, as well as small enough to preserve the natural mechanics of a host system. Here, we present a method for integrating microelectronic sensors and integrated circuits (ICs) into the elastomeric skin of a soft robot. The thin stretchable skin contains various solid-state electronics for orientation, pressure, proximity, and temperature sensing, and a Bluetooth-capable microprocessor. The components are connected by thin-film copper traces wetted with eutectic gallium indium (EGaIn), a room temperature liquid metal alloy that allows the circuit to maintain conductivity as it deforms under mechanical loading. In this talk, I will characterize the function of the individual sensors in air and water, discuss the integration of the microelectronic skin with a shape-memory actuated soft gripper, and demonstrate the sensorized soft gripper in conjunction with a 4 degree-of-freedom (DOF) robot arm.

Committee:
Carmel Majidi
Chris Atkeson
Phillip LeDuc
Eric Markvicka