Design and modeling of a micromechanical surface bonding system
Conference Paper, Proceedings of International Conference on Solid-State Sensors and Actuators (TRANSDUCERS '91), pp. 974 - 977, June, 1991
Abstract
Optimization of the design of a micromechanical surface fastening system is discussed based on a simple cantilevered beam model. Theoretical estimates indicate that the bonding strength of these microstructures can be as high as 11-17 MPa, or 1500-2000 psi. The equivalent surface energy corresponding to the stored strain energy during separation of two interlocked sample pairs is 14.6 mu J/cm/sup 2/. The authors also report preliminary experimental results; a bonding strength of 1.1 MPa or 160 psi per unit interlocked area has been achieved, which is in agreement with the theoretical approximation.
BibTeX
@conference{Han-1991-13265,author = {H. Han and Lee Weiss and M. L. Reed},
title = {Design and modeling of a micromechanical surface bonding system},
booktitle = {Proceedings of International Conference on Solid-State Sensors and Actuators (TRANSDUCERS '91)},
year = {1991},
month = {June},
pages = {974 - 977},
}
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